ProjectParameter
Maximum number of layers16 floors
Material typeFR-4, CEM-3, aluminum-based, copper-based, high-frequency board, high Tg, Rogers, etc.
Plate thickness
Minimum thickness0.3mm
Maximum thickness4.0mm
Finished board thickness tolerance
thickness<0.8mm&plusmn;12%
0.8mm-2.0mm&plusmn;10%
Thickness>2.0mm&plusmn;8%
Minimum hole size
Plate thickness<2.0mm&plusmn;12%
Plate thickness&ge;2.0mmAspect ratio&le;10
ProjectParameter
Panel size32&rdquo;X20&rdquo;(800mmx508mm)
Surface treatmentHASL, lead-free HASL, gold / silver / tin, gold finger, OSP, etc.
Solder maskGreen, white, yellow, red, blue, black, etc.
Exterior
Specification5mil / 8mil
ColourWhite, yellow, black
Basic copper thickness
Inner copper0.5oz - 3oz
Outer copper0.5oz - 3oz
Finished copper thickness
Inner copper1oz - 5oz
Outer copper0.5oz - 5oz
projectParameter
Insulation thickness0.06mm
Minimum track width3mil
Minimum track width3mil
Coating thickness
TechnologyPlating thicknessMinimum thicknessMaximum thickness
PTHPTH wall20um35um
Hard gold platedNickel100u&rdquo;&rdquo;300u&rdquo;
Gold1u&rdquo;30u&rdquo;
Shen JinNickel100u&rdquo;150u&rdquo;
Gold1u&rdquo;5u&rdquo;
Minimum solder ring
PTHPTH
>Tool hole6mil
ProjectParameter
Space from track to edgeCNC 0.25mm,V-CUT 0.4mm
digital controlV-CUTSize 630mm*630mn,Thickness 0.20mm
Impedance control tolerance%&plusmn;10%,Special control &plusmn;5%