东莞市大森电路有限公司
DongGuan Daysun Circuits Co.,LTD
Application area
widely used in Automotive, Medical, Consumer Electronics, Aerospace, Digital Communications, Industrial Control and LED
| ITEM | Capability |
| Month Capability | 500types/month,8,000sqm/month |
| Board Material | Standard FR4: Shengyi, ITEQ, KB, GDM High TG: S1000-2, IT180 |
| Surface treatment | OSP, HASL, LF-HASL, ENIG(Chem. Gold), Immersion Tin, Immersion silver, Plating hard gold, Gold fingers,Flash gold, ENEPIG |
| Tolerance | Board thickness tolerance 1.0mm: +/-0.1mm 1.0mm-2.0mm: +/-10% >2.0mm: +/-8% |
| Hole diameter tolerance PTH: +/-0.075mm NPTH:+/-0.05mm | |
| Hole location tolerance: +/-0.075mm | |
| Outline tolerance: < 100mm: +/-0.13mm 100mm-300mm: +/-0.15mm >300mm: +/-0.2mm | |
| Technical Specification | Layers: 1-24 layers |
| Min line width/space: 0.075/0.075mm | |
| Min hole: 0.15mm (mechanical drilling) | |
| Min pad ring: 0.2mm | |
| Max copper thickness: 8 OZ | |
| Max board size:1 layer: 450 X 800mm Multilayers: 500 X 600 mm | |
| Board thickness: 2-layers: 0.4-4.0mm Multi-layers: 0.4-4.0mm Inner layers: 0.1mm | |
| Board warpage: ≤1° | |
| Min solder mask bridge: 0.12mm | |
| Aperture ratio: 12:1 Best: 10:1 | |
| Plugging Vias capability: 0.2-0.6mm | |
| Au, Ni thickness control: Chem gold: Au:1-3u” Gold fingers: Au:1-30u” Flash gold: Au:1-10u” Hard gold:Au:1-30u” |